Combing high capacitance and low equivalent series resistance (ESR), TDK Corp. has introduced its CA series of vertically-stacked MEGACAP Type multi-layer ceramic capacitors (MLCCs) with a capacitance range from 20 nF to 150 µF. The new MLCCs are available with C0G, X7T, X7S, and X7R temperature characteristics and offer a rated voltage range from 25 V to 1,000 V.
TDK has adapted its MEGACAP stack design so that the MLCC elements are stacked side by side to achieve a low profile with increased capacitance. This vertically stacked design also enables stacks with three or more elements. The CA series will be available initially with 2x and 3x stacks, with future expansion with 5x stacks.
Other features include metal lead frames attached to the electrode ends of the components to protect against board flexure cracks and solder cracks from thermal shocks. The metal material of the terminal has been optimized to lower the ESR and achieve a higher ripple current capability, said TDK.
In addition, the hybrid joints between the metal terminals and the MLCCs are soldered and clamped to prevent the individual MLCC elements from falling out of the lead frame at higher reflow temperatures, said the company.
The new capacitors are suitable for the resonant circuits of wireless and plug-in charging systems such as for industrial vehicles and robots. They can also be used in smoothing and decoupling applications in industrial equipment. Production of the CA series began in April 2018. Automotive-grade products will be introduced after mid-2018.